Phenyl raw rubber (mainly referring to phenyl silicone rubber) exhibits superior comprehensive performance advantages in the field of thermal interface materials for electronic devices. With its wide temperature range stability, high thermal conductivity, and excellent electrical insulation properties, it has become a key material for heat dissipation solutions in high-end electronic devices.

I. Characteristics and Thermal Conductivity Advantages of Phenyl Raw Rubber
1. Basic Characteristics
Chemical Structure: Phenyl raw rubber is a polymer material based on methyl vinyl phenyl silicone rubber, containing phenylsiloxane or methylphenylsiloxane linkages in its main chain.

Classification Standards: Based on phenyl content, it is divided into three categories: low phenyl (5-10 mol%), medium phenyl (15-25 mol%), and high phenyl (30-50 mol%). Among them, high phenyl silicone rubber (phenyl content ≥30%) has the best radiation resistance and high temperature resistance.

Temperature Adaptability: Its operating temperature range reaches -100℃ to 350℃, far exceeding that of ordinary silicone rubber, making it particularly suitable for electronic device applications in extreme environments.

2. Thermal Conductivity Advantages
Basic Thermal Conductivity: The thermal conductivity of pure phenyl silicone rubber is approximately 0.2-0.3 W/m·K, which can be significantly increased to 0.8-15 W/m·K by adding thermally conductive fillers.

Wide Temperature Range Stability: Maintains stable thermal conductivity within a temperature range of -100℃ to 250℃, without significant changes in thermal resistance due to temperature fluctuations.

Low Compression Set: Maintains good thermal contact performance even under long-term pressure conditions, ensuring the continued effectiveness of the heat dissipation interface.

II. Types and Applications of Phenyl Raw Rubber-Based Thermal Interface Materials
1. Main Product Types
Thermal Conductive Silicone Sheets: Based on phenyl silicone rubber with added thermally conductive fillers such as carbon fiber and silicon carbide, achieving thermal conductivity of 1-15 W/m·K, widely used in LED power modules, 5G base station chips, and other applications.

Thermal Conductive Gel: Possesses excellent structural suitability and surface conformability, effectively filling uneven interfaces. Thermal conductivity is generally 2-6 W/m·K, suitable for microelectronic packaging.

Thermally Conductive Encapsulants: Phenyl silicone rubber-based thermally conductive encapsulants are widely used in new energy vehicle battery packs, providing both IP67 protection and thermal management.

High-Transparency Thermally Conductive Materials: Latest technology has developed high-transparency phenyl silicone rubber with a light transmittance exceeding 90%, suitable for special scenarios requiring optical performance.

2. Typical Application Scenarios
New Energy Vehicles: Thermal management of power battery packs and heat dissipation of electric drive and control systems; the amount of silicone rubber used per vehicle reaches 3-5 kg.

5G Communication Equipment: Base station chip heat dissipation; Huawei, ZTE, and other companies saw a 40% year-on-year increase in silicone rubber procurement in 2024.

AI Servers: Heat dissipation of high-density computing chips, meeting the stringent requirement of heat flux density >0.6 W/cm³.

Aerospace: Satellite electronic equipment maintains flexibility in low-temperature environments down to -60℃; nuclear power plant instruments achieve radiation resistance up to 10⁶ Gy dose.

III. Innovative Technologies for Enhancing Thermal Conductivity
1. Filler Optimization Technology
Borne Nitride (BN) Modification: Surface functionalization (e.g., KH550 coupling agent treatment) enables BN to form π-π interactions with phenyl silicone rubber, significantly improving interfacial bonding.

Multi-component Filler Synergy: A composite filler system using aluminum nitride, boron nitride, and aluminum oxide achieves a thermal conductivity exceeding 10.95 W/m·K.

Filler Particle Size Optimization: A 50μm aluminum particle filling system demonstrates significant junction temperature control in LED packaging above 5W.

2. Interface Engineering Innovation
Microstructure Bridging Technology: By combining chemical interface modification with ice template directional alignment, the thermal conductivity of the BN/SR composite material reaches 0.85 W/m·K (20wt% filler), a 286% improvement over pure silicone rubber.

Surface energy matching design: By adjusting the molecular chain length (such as C4 chain length) on the filler surface, the surface energy of the filler and the matrix are best matched, reducing the effective thermal resistance to 0.142 K·cm²·W⁻¹, which is more than 90% lower than that of unmodified materials.