Classification and application of electronic potting glue TWO
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Polyurethane potting compound
Polyurethane encapsulant is also called PU encapsulant, which is usually composed of polyols and diisocyanates of oligomers such as polyester, polyether and polydiene, and diols or diamines as chain extenders. to make. Potting compounds can generally be prepared using the prepolymer method and the one-step process.
Polyurethane potting materials are characterized by low hardness, moderate strength, good elasticity, water resistance, mildew resistance, shock resistance, transparency, excellent electrical insulation and flame retardancy, no corrosion to electrical components, and resistance to steel, aluminum, copper, tin It has good adhesion to other metals, as well as rubber, plastic, wood and other materials. Potting materials can make installed and debugged electronic components and circuits immune to vibration, corrosion, moisture and dust.
LED potting compound
LED encapsulant is an auxiliary material for LED encapsulation. It has high refractive index and high light transmittance. It can protect the LED chip and increase the luminous flux of the LED. It has low viscosity and easy degassing. It is suitable for potting and molding. Better durability and reliability.
characteristic
Low viscosity, good fluidity, suitable for molding complex electronic parts.
After curing, it forms a soft rubbery shape with good impact resistance.
Excellent heat resistance, moisture resistance and cold resistance, which can prolong the life of electronic accessories after application.
Addition type, room temperature and heat curing
It has excellent moisture-proof and waterproof effect.
use
For high-power street lamp power supply, power module, HID lamp power module, solar junction box potting protection, LED electronic display, LED electronic potting glue, potting of circuit boards, power cord bonding, LED, LCD high-power lamps , mobile phones, power boxes, ultra-thin computers, game consoles, digital cameras, airport runways, etc.
Precautions
● The product to be potted needs to be kept dry and clean;
● When using, please check agent A first, observe whether there is sedimentation, and stir agent A fully;
● Take the amount according to the proportion, and the weighing is accurate. Please remember that the proportion is the weight ratio rather than the volume ratio. After mixing the A and B agents, they should be fully stirred to avoid incomplete curing;
● After mixing evenly, please pour glue in time, and try to use up the mixed glue within the usable time;
● After pouring, the glue will gradually penetrate into the gap of the product, if necessary, please carry out a second pouring glue;
● During the curing process, please keep the environment clean to prevent impurities or dust from falling onto the surface of the uncured glue.
● This product will gradually solidify after mixing, its viscosity will gradually increase, and some heat will be released;
● The greater the amount of glue mixed together, the faster the reaction will be, the faster the curing speed will be, and it may be accompanied by a large amount of heat. Please pay attention to controlling the amount of glue at one time, because due to the accelerated reaction, it can be used for a long time. It will also be shortened, and the mixed glue should be used up in a short time as much as possible;
● Usable time: refers to the time when the viscosity of 100g mixed glue doubles at 25°C. After it is not operable, the glue must not be used;
● There are very few people who will have mild skin allergies and mild itching after long-term contact with the glue. It is recommended to wear protective gloves when using it. If it sticks to the skin, please wipe it off with acetone or alcohol, and clean it with detergent;
● Before using in large quantities, please try a small amount first to master the use skills of the product to avoid mistakes. It is a non-dangerous product and can be transported as a general chemical.