There are many high-power components in various electronic control modules, which will generate a lot of heat during use, which will gradually increase the temperature of the module during operation. In order to avoid damage to components and circuits due to excessive temperature, there must be proper heat dissipation channels to keep the control module working at a proper temperature. No matter what heat dissipation method is used, a thermally conductive material must be used as a medium to reduce the interface contact thermal resistance and increase the heat dissipation efficiency. Silicone materials include adhesives with thermal conductivity, potting glue, and gel potting materials, wherein the thermally conductive adhesive is used to bond and fix power components and heat sinks. Thermally conductive potting compounds and gels are used for module potting, and the technology's materials are used in engine control modules and powertrain modules.

Automotive electronics need shock, moisture and chemical resistance, and excess heat needs to be dissipated without damaging the tiny electronic boards. Specialty Filler High Purity Polymers and Specialty Chemicals are carefully selected to ensure all requirements are met.