Phenyl Raw Rubber in Pressure-Sensitive Adhesive Applications
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Phenyl raw rubber exhibits excellent removability, wide temperature range adaptability, and stability under special environmental conditions in pressure-sensitive adhesive applications, making it a key material in the high-end pressure-sensitive adhesive field.
1. Core Advantages of Phenyl Raw Rubber in Pressure-Sensitive Adhesives
1.1 High Removability
Patented technology developed by Foshan Benjia New Material Technology Co., Ltd. demonstrates that by adding phenyl silicone rubber as a surface energy modifier to hot-melt pressure-sensitive adhesives, the adhesion between the adhesive layer and the surface of the adhered object can be significantly reduced, thereby improving removability.
This technology uses naphthenic oil, phenyl silicone rubber, hydrogenated styrene block copolymer, and tackifying resin (hydrogenated petroleum resin) as raw materials. By reducing surface energy, it achieves residue-free removal, making it particularly suitable for scenarios requiring repeated bonding.
1.2 Wide Temperature Range Adaptability
Low-phenyl silicone rubber (5-10% phenyl content) maintains good flexibility at -100℃, and its curing temperature can be reduced to -115℃, making it particularly suitable for pressure-sensitive adhesive applications in low-temperature environments.
Medium-phenyl silicone rubber (15-25% phenyl content) exhibits ablation resistance and is suitable for high-temperature environments.
High-phenyl silicone rubber (over 30% phenyl content) can withstand 2.58 × 10⁴ C/kg gamma-ray radiation and is suitable for special radiation environments.
2. Application Forms of Phenyl Raw Rubber in Pressure-Sensitive Adhesives
2.1 Organosilicone Pressure-Sensitive Adhesives
Phenyl-based pressure-sensitive adhesives maintain high adhesive strength at both high temperatures (260℃) and low temperatures (-73℃), exhibiting high viscosity, high peel strength, and high adhesion.
In contrast, methyl-based pressure-sensitive adhesives often lose adhesion at high viscosity, limiting their application range.
Organosilicone pressure-sensitive adhesives can bond to a variety of difficult-to-bond materials, including untreated polyolefins, fluoroplastics, polyimides, and polycarbonates.
2.2 Development of Specialty Pressure-Sensitive Adhesives
By adjusting the phenyl content (5%-40%) and vinyl content (0.16%-0.23%), specialty pressure-sensitive adhesives suitable for different environments can be prepared.
For example, a phenyl content of 5%-10% can improve flame retardancy while avoiding affecting processing performance and high-temperature resistance; a vinyl content of 2%-5% helps participate in the vulcanization reaction, reduces internal stress, and improves adhesion.
3. Innovative Applications and Technological Development
3.1 Flexible Pressure-Sensitive Composite Materials
The China Academy of Engineering Physics has developed flexible pressure-sensitive composite materials based on phenyl silicone raw rubber. By forming a microporous structure in the phenyl silicone raw rubber composite foam material layer and depositing modified carbon nanotubes, the problems of peeling and stability after composite material preparation have been solved.
This technology uses an electric field to induce hydrogen bonds between carbon nanotubes and benzene rings in the phenyl silicone raw rubber, enhancing the bonding force between materials and significantly improving the service life of the composite material.
3.2 Flame-Retardant and Radiation-Resistant Pressure-Sensitive Adhesives
The self-extinguishing properties of phenyl silicone rubber make it an ideal choice for flame-retardant pressure-sensitive adhesives, particularly suitable for aerospace, electronics, and other fields with high safety requirements.
In the aerospace field, phenyl silicone rubber pressure-sensitive adhesives are widely used in the manufacture of components such as sealing rings, gaskets, pipes, and rods, ensuring the stable operation of spacecraft in the harsh space environment.
4. Expanding Application Areas
4.1 Aerospace and Defense Industries
Phenyl silicone rubber pressure-sensitive adhesives maintain stable performance over a wide temperature range of -110℃ to 400℃, making them the preferred sealing material for aerospace vehicles.
Its radiation and ozone resistance properties enable it to perform excellently in the space environment, effectively coping with the frequent temperature changes during satellite orbital operation.
4.2 Electronics, Electrical Appliances, and Medical Fields
In the electronics industry, phenyl silicone rubber pressure-sensitive adhesives, with their excellent electrical insulation properties and weather resistance, have become the preferred material for circuit board protection, cable joint sealing, and electronic component packaging.
Medical-grade silicone pressure-sensitive adhesives are widely used in medical applications and transdermal therapy (TTS) formulations due to their non-toxic, odorless, non-irritating, and physiologically inert properties.
5. Market Prospects and Development Trends
With the increasing demands of high-end manufacturing and special environmental applications, the application of phenyl raw rubber in the pressure-sensitive adhesive field will become even more widespread. Future development trends include:
Multifunctional Integration: Developing multifunctional pressure-sensitive adhesives that combine high removability, flame retardancy, and radiation resistance.
Enhanced Environmental Performance: Reducing the use of harmful solvents and developing more environmentally friendly preparation processes.
Customized Solutions: Precisely controlling the phenyl content and molecular structure according to the needs of different application scenarios.
Phenyl raw rubber, with its unique molecular structure and performance advantages, is driving the development of pressure-sensitive adhesive technology towards higher performance and wider application areas, providing reliable bonding solutions for high-end fields such as aerospace, electronics, and medical.