Phenyl silicone rubber exhibits excellent thermal conductivity and wide temperature range stability in electronic device heat dissipation materials, making it a key material for heat dissipation systems in high-end electronic devices such as 5G base stations, AI servers, and new energy vehicles. Its high thermal conductivity (up to 6.99 W/(m·K)) and wide temperature range applicability from -90℃ to 210℃ effectively solve the thermal management challenges of high-power electronic components.
I. Core Advantages and Characteristics
1. Wide Temperature Range Performance Advantages
Low-temperature stability: The glass transition temperature (Tg) of phenyl silicone rubber can be as low as -105℃, and its compression cold resistance coefficient reaches 0.49 at -70℃, ensuring elasticity even in extremely low-temperature environments.
High-temperature resistance: It maintains excellent high-temperature resistance above 250℃, far exceeding ordinary silicone rubber.
Wide temperature range adaptability: It can operate stably in an extreme temperature range of -90℃ to 210℃, perfectly adapting to the diverse needs of electronic equipment from polar scientific research to high-temperature industrial environments.
2. Excellent Thermal Conductivity
High thermal conductivity: By adding carbon-based fillers (such as MXene, carbon fiber), the thermal conductivity of phenyl silicone rubber composite materials can be increased to 6.99 W/(m·K), an increase of 250%-360% compared to conventional thermally conductive silicone sheets (1.5-2.0 W/(m·K)).
Three-dimensional thermal conductivity network: By constructing a highly conductive/electrically conductive three-dimensional carbon-based filler structure, the interfacial thermal resistance is significantly reduced, allowing heat to be quickly transferred to the heat sink.
3. Multifunctional Integrated Characteristics
Electromagnetic shielding performance: Phenyl silicone rubber composite materials can simultaneously achieve an electromagnetic shielding effectiveness of 76.00 dB, solving the dual challenges of electromagnetic interference and heat dissipation in the 5G era.
Excellent electrical insulation: Breakdown voltage reaches ≥6 kV/mm, effectively isolating electrical components and avoiding short-circuit risks.
Lightweight and high-strength characteristics: The density is only 3.0±0.5 g/cc, and it also has good flexibility and compressibility, allowing it to perfectly fit irregular surfaces. II. Specific Applications in Electronic Device Cooling
1. 5G Communication Equipment Cooling
Base station cooling: The NF150-300 series high-thermal-conductivity phenyl silicone rubber sheets (thermal conductivity 3.0 W/m·K) have been successfully applied to 5G integrated base stations, reducing the peak temperature of the power amplifier module by 2-3℃, ensuring stable operation of the equipment in high-temperature environments.
Case verification: Tests by a leading small base station manufacturer showed that after using phenyl silicone rubber thermal pads, the core chip temperature stabilized at approximately 80℃, the peak temperature of the power amplifier module decreased by 2-3℃, while the supply cycle was shortened by 30% and procurement costs were reduced by 20%.
2. High-End Computing Equipment Cooling
AI server cooling: Phenyl silicone rubber composite materials are used for AI server chip cooling. Their wide temperature range performance ensures effective heat dissipation during high-load computing, preventing chip overheating and frequency reduction.
Thermal interface materials: As thermal interface materials (TIMs), they fill the tiny gaps between the CPU, GPU, and heat sink, eliminating air layers and improving heat transfer efficiency by more than 40%.
3. New Energy Vehicle Electronic System Cooling
Battery management system: Phenyl silicone rubber thermal pads are used between battery modules, improving temperature difference control accuracy to ±0.3℃, significantly extending battery life.
Electronic control system cooling: Applied in motor controllers, ensuring stable operation of power devices in high-temperature environments. After adoption by a new energy vehicle company, the temperature difference control accuracy of the battery module reached ±0.3℃.
4. Special Electronic Equipment Cooling
Aerospace electronic equipment: Used for cooling electronic systems in satellites and spacecraft. Its radiation resistance (γ-ray tolerance exceeding 10⁶Gy) ensures reliable operation in extreme space environments.
Precision instrument cooling: Applied in lithography machines and precision measuring instruments, achieving 0.1μm level pressure fluctuation control, guaranteeing equipment accuracy.

III. Technological Development Trends
1. Performance Improvement Directions
Higher thermal conductivity: By optimizing the phenyl content and filler ratio, the goal is to increase the thermal conductivity to 8-10 W/(m·K) to meet the higher power density requirements of AI chips.
Ultra-thin development: Developing ultra-thin thermal pads with a thickness of ≤0.3mm to adapt to the trend of thinner and lighter consumer electronic devices. 2. Environmental Protection and Sustainable Development
Bio-based Material Development: In response to the "dual carbon" goals, we are developing bio-based phenyl silicone materials with a renewable utilization rate of ≥85%.
Green Production Process: We are adopting a more environmentally friendly chemical foaming process to reduce VOC emissions, meeting the stricter environmental standards of 2025.
3. Multifunctional Integration
Thermal Conductivity/Electromagnetic Shielding Integration: Further optimizing the three-dimensional filler structure to achieve synergistic improvement of thermal conductivity and electromagnetic shielding performance, addressing the complex needs of 5G/6G devices.
Smart Temperature Control Materials: Developing phenyl silicone rubber with temperature-responsive characteristics to achieve dynamic adjustment of heat dissipation performance.

IV. Market Outlook
From 2025 to 2030, the Chinese silicone rubber thermal pad market is expected to grow from 6.8 billion RMB to 12.6 billion RMB, with a compound annual growth rate (CAGR) of 13.2%. Among them, the demand for thermal management in automotive electronics will jump from 18% in 2025 to 29% in 2030, becoming the fastest-growing segment. Phenyl silicone rubber, with its excellent wide-temperature range performance and high thermal conductivity, will occupy an increasingly important position in the high-end thermal management materials market, especially in high-growth areas such as new energy vehicles, 5G communication, and AI computing.
With continuous technological advancements and the expansion of application fields, the application of phenyl silicone rubber in electronic device thermal management materials will become more widespread and in-depth, providing more efficient and reliable solutions to address the challenges of electronic device thermal management.