Foamed silicone rubber can be modified by introducing phenyl groups, but the following performance changes need to be weighed:

Improved temperature resistance: The phenyl structure can widen the operating temperature range (e.g., low-phenyl type withstands -100℃, high-phenyl type withstands 250℃).

Increased processing difficulty: When the phenyl content exceeds 25%, the molecular chain rigidity increases, which may complicate the foaming process.

Applicable scenarios: For applications requiring resistance to extreme temperatures or radiation (e.g., aerospace thermal insulation layers), medium/high phenyl modification is feasible; for conventional foaming applications, low-phenyl or unmodified silicone rubber is recommended.

Need a specific foaming process parameter comparison table? We can help you quickly screen for the temperature-performance balance point suitable for phenyl content.