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Properties of thermal conductive silicon film

Hits: 3893602 2020-04-15

The thermal conductive silicone gasket is also known as thermal conductive silicone film or thermal conductive silicone gasket. Its main performance advantages include:
(1) The thermal conductive silica gel sheet can achieve the closure of the structural process difference, reduce the requirements of the thermal radiator and the thermal structural parts. The thickness and softness of the thermal conductive silica gel sheet can be adjusted according to the different design, so the thermal conductive channel can close the thermal structure and chip size difference, reduce the requirements of the structural design for the production of the contact surface of the radiator, especially for the flatness, Poor roughness. If the processing accuracy of heat-conducting material contact is improved, the product cost will be greatly increased. Therefore, the heat-conducting silica gel sheet can fully increase the contact area between the heat generator and the heat sink, and reduce the production cost of the radiator and the contact. In addition to the most widely used thermal silicon film in the PC industry, the new heat dissipation scheme of the product is to remove the traditional radiator, and unify the structure and radiator into a heat dissipation structure. In the PCB layout, the heat dissipation chip is arranged on the back, or in the front layout, a heat dissipation hole is opened around the chip requiring heat dissipation, the heat is led to the back of the PCB through copper foil, etc., and then the heat conduction channel is filled through the heat conduction silicon film to guide to the heat dissipation structure (metal bracket, metal shell) under or on the side of the PCB, so as to optimize the overall heat dissipation structure. In this way, not only the cost of the whole heat dissipation scheme of the product is greatly reduced, but also the volume of the product is minimized and the portability is realized.
(2) The range and stability of thermal conductivity, thermal conductivity of silica gel sheet in the optional range of thermal conductivity is broader, its products can be from 0.8w/k.m to 3.0w/k.m or more, and the performance is stable, long-term use is reliable. Compared with the current maximum thermal conductivity of the double-sided heat conductive adhesive is not more than 1.0w/k-m, the thermal conductivity is poor. Compared with the thermal conductive silicone film, the thermal conductive silicone grease is solidified at room temperature. It is easy to produce surface cracks or unstable performance at high temperature, and it is easy to volatilize and flow. The thermal conductivity will gradually decline, which is not conducive to long-term reliable system operation
(3) The advantages of shock absorption and sound absorption are that the silica gel carrier of the thermal conductive silicon film determines its good elasticity and compression ratio, so as to achieve the shock absorption effect. If the density and soft hardness are adjusted again, the low-frequency electromagnetic noise can be well absorbed. Compared with the use of heat-conducting silicone grease and heat-conducting double-sided adhesive, other heat-conducting materials do not have the effect of shock absorption and sound absorption.
(4) Electromagnetic compatibility (EMC), insulating performance thermal conductive silica gel sheet has insulating thermal conductivity due to its own material characteristics, which has good protection for EMC. Due to the reason of silica gel material, it is not easy to be pierced and torn or damaged under pressure, so EMC reliability is better. Due to the limitation of its material characteristics, the thermal conductive double-sided adhesive has low EMC protection performance, which can not meet the customer's requirements in many times, and is limited in use. Generally, it can only be used when the chip itself has been insulated or the chip surface has been EMC protected. Thermal conductive silicone grease has low EMC protection performance due to its material characteristics, which can not meet customers' requirements in many cases, and is limited in use. Generally, it can only be used after the chip itself has been insulated or the chip surface has been protected by EMC.
(5) The convenience of reuse. The heat-conducting silica gel sheet is stable and solid, with optional coating strength, easy to disassemble and reuse. Once used, the heat-conducting double-sided adhesive is not easy to disassemble, and there is a risk of damaging chips and surrounding devices, so it is not easy to disassemble completely. When scraping thoroughly, it will scratch the chip surface and bring dust, oil and other interference factors when wiping, which is not conducive to heat conduction and reliable protection. The thermal conductive silicone grease must be wiped carefully, and it is not easy to wipe thoroughly on average. Especially in the test of changing the thermal conductive medium, it will affect the reliability of the test data, thus affecting the judgment of the engineer.
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