Conference background
With the technical development of 5g, big data, artificial intelligence, Internet of things, industry 4.0, national major strategic needs and other fields, the power density of electronic devices continues to rise, and efficient thermal management materials and schemes are urgently needed to ensure the efficiency, reliability, safety, durability and sustainable stability of products.
With the theme of "innovation and application of advanced thermal management materials in consumer electronics industry", this forum discusses the technical pain points and application hotspots of advanced thermal management materials industry, and explores the value advantages and application scenarios of advanced thermal management materials in consumer electronics, 5g, high-power chips, batteries and other industries. Guided by solving the technical problems and application scenarios of thermal management materials and solutions in science and technology industry, absorbing the industry vision of the world's top companies and research institutions, integrating industrial chain resources in the field of thermal management materials and meeting the needs of many manufacturers, transferring breakthrough research findings and solutions from laboratory docking to the market, and promoting the development of thermal management industry.
Organization
Sponsor: functional carbon materials laboratory, Ningbo Institute of materials, Chinese Academy of Sciences, DT new materials
Co organizer: Dongguan daorui graphene Research Institute, Guangdong murui Technology Co., Ltd
Organizer: Ningbo detai Zhongyan Information Technology Co., Ltd
Jointly organized by Shenzhen advanced electronic materials International Innovation Research Institute
Executive Chairman
Lin Zhengde, researcher, Ningbo Institute of materials technology and engineering, Chinese Academy of Sciences
Conference theme
(including but not limited to)
Theme 1: policy and market
1. Policy & trend, standard, analysis test, certification test, investment and financing
2. Thermal management integration technology and scheme: thermal management technology and application of thermal module, mobile phone, computer, smart home appliances, electronic products, led, battery, etc
Topic 2: thermal interface materials
1. Heat conduction pad
2, thermal conductive silica gel, thermal conductive gel
3. Carbon based thermal interface material
Topic 3: heat sink materials
1. Metal, alloy (semi-solid die casting), graphite, PI film (raw material and graphitization process)
2. Metal matrix composites: graphite, diamond, carbon nanotubes, graphene, carbon fiber with high thermal conductivity, inorganic materials (such as porous silicon carbide, silicon, boron nitride)
3. Polymer based composites: thermal conductive fillers, such as metals (copper, silver, gold, nickel and aluminum), carbon (amorphous carbon, graphite, diamond, carbon nanotubes and graphene), ceramics (boron nitride, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, beryllium oxide, aluminum oxide, zinc oxide, silicon oxide), etc
Topic 4: phase change materials
1. Heat pipe (HP), soaking plate (VC)
2. Paraffin, fatty alcohol, fatty acid, alkane based alloy
3. Molten salt, salt water complex, eutectic mixture
Theme 5: functional materials
1. Radiation cooling: graphene coating / slurry / coating
2. Thermal insulation materials: carbon based aerogels, silica aerogels, two zirconia aerogels, alumina aerogels, carbon felt, and composite silicates.
3. Heat conducting fluid: high heat conducting coolant, nanofluid
Conference schedule
Thursday, May 21, 2020
12: 00-17:00 registration
May 22, 2020 (Friday)
09:00-12:00 opening speech, conference report
14: 00-17:30 meeting report
12: 00-14:00 lunch
18: 00-20:00 exchange dinner
May 23, 2020 (Saturday)
09:00-12:00 meeting report project Roadshow
14: 00-17:30 meeting report needs meeting
12: 00-14:00 lunch
Contemporaneous activities
1. Investment and financing Summit
Roadshow of thermal management material technology and Scheme Project
2. Demand meeting
Graphene thermal interface material, graphene conduction / heat dissipation technology and application, advanced thermal management carbon material, phase change material, heat conduction / heat dissipation coating, coating, new process and forming of thermal management material, radiation heat dissipation material, high heat conduction material, heat management design and scheme, heat storage material, ultra-high heat flux material, heat conduction insulation material, heat dissipation composite material, Fire and heat insulation materials, equipment lightweight heat insulation materials, test equipment, thermal equipment (continuous updating)
Registration of participants
1. Conference Registration
Please scan the MAC QR code to register
Meeting contact
Chen Xi (participants, exhibitors, sponsors, reports)
Tel: 18368497767 (wechat same number)
Email: chenxi@polydt.com
Han Xiaoxia (project roadshow and demand docking)
Tel: 18958323273 (wechat same number)
Email: xiaoxiahan@polyt.com