With the vigorous development of the electronic industry, people pay more attention to the stability of products, and have more stringent requirements for the weather resistance of electronic products. Therefore, more and more electronic products now need to be potted, and the potted electronic products can enhance their performance. Waterproof ability, shock resistance and heat dissipation performance, protect electronic products from the erosion of natural environment and prolong their service life.

The potting of electronic products is generally made of silicone material, because it has good high and low temperature resistance, can withstand cold and heat changes between -60°C and 200°C without cracking and maintains elasticity. The material has good thermal conductivity after filling and modification. After potting, it can effectively improve the heat dissipation capacity and moisture-proof performance of electronic components, and the electronic potting compound made of silicone material is soft after curing, which is convenient for the maintenance of electronic equipment. , Compared with the electronic potting glue made of epoxy resin, after potting and curing, the hardness is high, and the electronic components are easy to be pulled. The temperature is only -10 ℃ ~ 120 ℃, which is generally only suitable for electronic equipment without special requirements for the environment.

However, silicone encapsulant also has two disadvantages: 1. Poor adhesion. When used as a potting and coating material, in order to improve the adhesion with the basic substrate, it is usually necessary to pre-coat the substrate in advance. Handling or adding tackifiers is cumbersome to use. 2. It is easy to be poisoned (not cured). The silicone potting compound is a relatively environmentally friendly potting compound. The platinum curing agent is relatively active, and it is easy to react with other impurities and cause poisoning. This requires strengthening the quality control of the adhesive, improving the anti-toxicity of the colloid, maintaining a stable curing ability, and at the same time having a certain bonding ability.