Electronic potting glue is liquid before curing and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. The potting glue can realize its use value only after it is completely cured.

What are the classifications of electronic potting glue? There are many types of electronic potting adhesives, mainly including: thermally conductive potting adhesive, epoxy resin potting adhesive, silicone potting adhesive, polyurethane potting adhesive, and LED potting adhesive.

Thermally conductive potting compound
Thermally conductive potting compound (HCY) is a low-viscosity flame-retardant two-component addition type silicone thermally conductive potting compound. It can be cured at room temperature or heated. It has the characteristics that the higher the temperature, the faster the curing. It is made of ordinary potting silica gel or adhesive silica gel by adding thermal conductors. Generally, the products made by excellent manufacturers: no by-products will be produced during the curing reaction, and can be applied to PC (Poly-carbonate) , PP, ABS, PVC and other materials and metal surfaces. It is suitable for heat conduction, insulation, waterproof and flame retardant of electronic accessories, and its flame retardant should reach UL94-V0 level. To comply with the EU ROHS directive requirements. The main application area is the potting of electronic, electrical components and electrical components, and it is also used in similar temperature sensor potting and other occasions.

epoxy resin potting glue
Through the EU ROHS standard, the cured product has high hardness, smooth surface, good gloss, and has the characteristics of fixation, insulation, waterproof, oil-proof, dust-proof, anti-theft, corrosion resistance, aging resistance, and thermal shock resistance. Used for packaging of electronic transformers, AC capacitors, negative ion generators, aquarium water pumps, ignition coils, electronic modules, LED modules, etc. It is suitable for potting of small and medium-sized electronic components, such as automobile, motorcycle igniter, LED driving power supply, sensor, toroidal transformer, capacitor, trigger, LED waterproof lamp, confidentiality, insulation, moisture-proof (water) of circuit board. Potting.

Silicone encapsulant
There are many types of silicone potting compounds. Different types of silicone potting compounds have great differences in temperature resistance, waterproof performance, insulation properties, optical properties, adhesion and adhesion to different materials, and softness and hardness. Silicone encapsulants can be added with some functional fillers to give them properties such as electrical conductivity, thermal conductivity, and magnetic conductivity. The mechanical strength of silicone encapsulant is generally poor, and it is precisely this performance that is used to make it "breakable" for easy maintenance, that is, if a component fails, you only need to pry open the encapsulant and replace it with a new one. After the original copy, you can continue to use it.

The color of the silicone potting compound can generally be adjusted arbitrarily according to the needs. Either transparent or non-transparent or colored. Silicone potting compound performs very well in shockproof performance, electrical performance, waterproof performance, high and low temperature resistance, and anti-aging performance.

Two-group silicone encapsulants are the most common, including condensation and addition types. Generally, the condensation type has poor adhesion to the components and the potting cavity, and volatile low-molecular-weight substances will be produced during the curing process, and there will be obvious shrinkage after curing. Addition type (also known as silicone gel) has minimal shrinkage and no low-molecular-weight formation during curing. It can be cured quickly by heating.